In 2024, Samsung Semiconductor launched the ISOCELL ALOP (All-Lens Optical Prism) camera technology. By reconstructing the optical structure of telephoto camera modules, this technology achieves a leap in low-light imaging quality while maintaining the slim design of smartphones. It has been certified with the 2025 CES Innovation Award.
In traditional folded zoom telephoto modules, the lens is vertically placed between the prism and the sensor. When increasing the lens diameter to improve light intake, the module will inevitably become thicker and the phone body will protrude significantly. The ALOP technology innovatively places the lens horizontally on top of the prism, parallel to the smartphone body. Equipped with a 40° tilted prism reflective surface and a 10° tilted sensor component, it achieves an f/2.58 large aperture at an 80mm focal length. While significantly enhancing light intake, the module length is 22% shorter than that of traditional designs, completely breaking the "thick and protruding" constraint. Its unique "lens + prism synchronous horizontal movement" focusing mechanism avoids the thickness increase caused by vertical movement. Combined with algorithm-based image shift correction, it balances focusing accuracy and structural compactness.
Currently, this technology is in the countdown to commercialization and is expected to be first installed in new Samsung Galaxy series phones, providing low-noise and high-definition imaging solutions for night portraits and long-distance shooting.
Predictions on the Future Development Direction of Smartphone Camera Modules
1. Optical Structure Reconstruction: In-depth Balance Between Slim Design and Light Inlet
The ALOP technology has verified the feasibility of the "spatial reuse" design. In the future, modules will further reduce their size through methods such as optimizing the tilt angle of prisms and innovating lens array stacking. For example, using prism materials with higher refractive indices to achieve longer optical paths under the same thickness; or drawing on the "lens-prism integration" concept to integrate multiple lens groups and optical components into a single package. This will help push the module thickness to below 3mm, while achieving an aperture of f/2.0 or smaller through a larger effective pupil diameter (EPD).
2. Telephoto as a Core Differentiator: Coordinated Upgrade of High Magnification and Image Quality
As the size of the main camera sensor approaches the 1-inch limit, telephoto modules have become a key competitive focus for manufacturers. In the future, a technical combination of "ALOP-like structure + large-sized sensor" will be formed, enabling "non-protruding" design in optical zoom of 10x or more. At the same time, through multi-prism graded refraction technology, the physical limit of 20x optical zoom will be broken, meeting the needs of long-distance shooting and professional creation.
3. In-depth Integration of Optics and Algorithms: Eliminating Side Effects of Structural Innovation
To address issues such as aberration and center shift that may arise from tilted sensors and folded optical paths, AI algorithms will be deeply integrated into the imaging process. By real-time mapping of optical distortion models to dynamically correct image shifts, and combining with scene-specific noise reduction algorithms, the low-light imaging advantages of ALOP technology will be further amplified, achieving dual benefits of "hardware-based light intake + software-based optimization".
4. Integrated Design of Multi-camera Modules: Balancing Functionality and Aesthetics
The ALOP technology enables telephoto lenses to have a circular appearance that is visually consistent with wide-angle and ultra-wide-angle lenses. In the future, multi-camera modules will move toward "optical structure standardization". By sharing prism components and unifying focusing drive modules, the physical gap between modules will be reduced. At the same time, hidden lens covers and gradient-color protruding designs will be adopted to balance "visual invisibility" and functional integration.
5.Cross-scenario Technology Migration: Expanding the Application Boundaries of Modules
The "slim, lightweight and high light-sensitivity" characteristics of ALOP will extend to more scenarios: in foldable smartphones, flexible prism structures will be adapted to solve imaging problems in the crease area; in security and AR devices, miniaturization transformation will enable hidden high-definition shooting, promoting technical interconnection between consumer electronics and professional equipment.
