Dvp Camera Module
Your Professional Camera Module Manufacturer
Guangzhou Sincere Information Technology Ltd. is a professional and high-tech leading company in integrated optical device manufacturer and optical imaging system solution provider since 1992's foundation. We specialize in the production of various camera modules to help you create highly customized camera module solutions, including 0.1mp to 200mp MIPI camera modules and USB camera modules as well as endoscope camera modules with a diameter of 0.9mm~10mm.
Quality Assurance
All our camera modules must be inspected by professional QC, and the products are inspected in strict accordance with national standards before shipment. And the entire process is strictly implemented in accordance with the ISO9001 quality system.
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Advanced Equipment
Professional AA (Active Alignment) equipment manufacturing, COB 100 level dust-free workshop.
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Professional Technical Team
We have been manufacturing camera modules for over 30 years. And we have top professional R&D talents, management talents and sales elites with rich experience.
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Good Service
We provide 1-year replacement and 10-year warranty services. Additionally, we can provide training on how to use the camera module.
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Reasonable Price
We offer competitive price to achieve win-win.
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The DVP camera module is an integrated camera component that utilizes the DVP (Digital Video Port) interface, designed for efficient image data transmission in various vision systems. It communicates with the processor through parallel data lines and a synchronized clock signal, offering stable and reliable image capture and transmission capabilities.
Advantages Of DVP Camera Module
Low Cost
The DVP interface adopts parallel transmission, eliminating the need for complex serial demodulation circuits. The PCB design is simple (no impedance matching required), making it suitable for low-cost hardware solutions.
Wide Compatibility
Supports older processors (such as ARM9, low-end FPGA, DSP, etc.), no dedicated IP core required, low development threshold, and strong adaptability. It is commonly seen in early embedded devices and is convenient for maintenance and upgrade.
Real-time Data Transmission
Parallel interfaces eliminate protocol layer latency and achieve pixel-level synchronization. It is suitable for high real-time applications such as industrial sorting and robot vision.
Simple Development
The protocol is simple (directly output RAW/RGB/YUV data), and debugging is convenient, suitable for rapid prototyping development. No complex drivers are required, making it suitable for beginners or small teams. No complex drivers are required, making it suitable for beginners or small teams.
Low Power Supply Requirements
Usually only 3.3V or 1.8V power supply is needed, with relatively low power consumption.
High Flexibility
Supports multiple low-resolution sensors (such as OV7670, OV7725, etc.), suitable for applications below 720p.
Types of DVP Camera Module
ESP32 DVP camera module
Integrated with DVP parallel bus and ESP32 dedicated driver, it supports high-speed image transmission and can be equipped with built-in JPEG compression and WiFi protocol stack. It is suitable for IoT smart access control and wireless inspection robots.
Macro DVP camera module
It can be equipped with a large-pixel sensor and a large-aperture lens, supporting an ultra-close focusing distance. It is specially designed for precise scenarios such as PCB solder joint inspection and biological cell microscopic imaging.
Real Time Monitoring DVP Camera Module
High-definition and low-latency video streams are achieved through H.264/H.265 hardware encoding, and it is applied in elderly care homes and infant safety monitoring systems.
External Trigger DVP camera module
Supports programmable TTL trigger signals, suitable for time-sensitive scenarios such as quality control on industrial production lines and multi-camera 3D reconstruction.
Small Size DVP camera module
Features an ultra-compact package, integrates a bridge chip and low-power solution, suitable for space-constrained devices such as endoscopes and gimbal mounts for drones.
Low-cost DVP camera module
Based on a low-cost sensor solution, it supports YUV422/RGB565 output and a signal-to-noise ratio of over 36dB, making it suitable for consumer products such as shared bike locks recognition and children's educational robots.
Application of DVP Camera Module
The Internet of Things Wireless Inspection Robot
Can enable autonomous robots to achieve real-time image transmission during pipeline monitoring or factory equipment inspection.
Automatic Microscope-type Solder Joint Analyzer
By capturing the sub-millimeter details of solder joints on printed circuit boards, it enables automated quality control in the electronic manufacturing process.
Infant And Toddler Real-time Monitoring System
This system combines low-latency video transmission with artificial intelligence algorithms to monitor infants and toddlers and notify caregivers immediately in case of falls or emergencies.
Automobile Assembly Line 3D Scanning Station
By synchronizing multiple cameras through a TTL trigger, a 3D model of the engine component can be reconstructed, thereby achieving precise quality verification.
Sewer Pipe Detector
With its compact design and low-power operation mode, it is capable of detecting potential hazards in sewer pipes.
AI Early Education Robot
Can provide children with basic object recognition and interactive learning functions.
Process of DVP Camera Module
Hardware Design and Material Preparation
(1) Sensor Selection
1. Select the appropriate CMOS sensor (such as OV series, Goke Micro GC series, etc.), and determine the resolution (such as VGA, 720P) and output format (RAW/RGB/YUV).
2. Ensure that the sensor supports the DVP interface (parallel data output).
(2) PCB Design
1. Design the DVP interface circuit, including data lines (8/10/16-bit), control signals (VSYNC/HSYNC/PCLK), and power management.
2. Optimize the layout to reduce signal interference (DVP is sensitive to noise).
3. It may integrate an ISP (Image Signal Processor) or directly output the original data.
(3) Material Procurement (BOM List)
1. Core materials: CMOS sensors, lenses, PCB boards, FPC (Flexible Circuit Board), IR filters, etc.
2. Auxiliary materials: Connectors, passive components (resistors/capacitors), structural parts (housings, brackets).
SMT Assembly (PCBA Process)
(1) PCB Printing And Solder Paste Application
Print Solder Paste on the PCB pads.
(2) Component Mounting
Use an SMT placement machine to precisely mount tiny components such as sensors, resistors, and capacitors onto the PCB.
(3) Reflow Soldering
The high-temperature reflow soldering furnace melts solder paste and fixes components.
(4) AOI Inspection (Automatic Optical Inspection)
Check the welding quality to avoid problems such as false welding and short circuits.
Module Assembly
(1) Lens Assembly
1. Align the lens (fixed focal length or autofocus) with the sensor to ensure that the optical centers match.
2. High-precision calibration is carried out using AA (Active Alignment) devices.
(2) Installation of IR filters
Install infrared filters (IR-Cut) as required to reduce the interference of ambient light.
(3) Structural Encapsulation
1. Fix the PCB, lens and housing to ensure mechanical stability.
2. It may be cured with glue or fixed with screws.
(4) FPC connection
Weld or crimp FPC (Flexible flat cable) for connecting the main control board.
Testing And Calibration
(1) Electrical Testing
Check whether the power supply and signal lines are normal and whether the DVP data output is stable.
(2) Image Testing
1. White balance calibration: Adjust the RGB gain to ensure accurate white display.
2. Automatic Exposure (AE) Calibration: Optimize the brightness range.
3. Autofocus (AF) test (if supported).
4. Dead point detection: Check if the sensor has any dead points or noise.
(3) Environmental Testing
1. High and low temperature tests (-20℃ to 70℃) are conducted to ensure stability.
2. Vibration/drop test (for industrial or automotive applications).
Packaging and Shipment
1. Anti-static packaging to prevent damage during transportation.
2. Provide the Datasheet and driver code (such as Linux drivers).
Components of DVP Camera Module
Lens: The lens is responsible for collecting light and focusing it onto the image sensor. Lenses are usually composed of multiple lenses and are used to correct aberrations and improve image quality. The lens also includes an aperture and an autofocus mechanism for controlling the amount of light entering the lens and enabling autofocus .
Image Sensor: The image sensor converts optical signals into electrical signals to generate image data. Common types of image sensors include CMOS and CCD. CMOS sensors are widely used in consumer electronics because of their low power consumption and low cost, while CCDS are suitable for high-end applications because of their high sensitivity .
Image Signal Processor (ISP): The ISP is responsible for processing the raw data output by the image sensor, including noise reduction, color correction, Auto Exposure (AE), Auto white Balance (AWB), and HDR synthesis. Isps can be integrated on a standalone chip or on a system-on-chip (SoC) .
Other Components:
Filter: Used to filter out unwanted light and improve image quality. Common filters include infrared cut-off filters and color filters .
Focusing And Optical Image Stabilization Components: Including autofocus mechanisms (such as voice coil motors and piezoelectric motors) and optical image stabilization mechanisms for achieving fast focusing and compensating for hand shake to improve imaging stability .
Housing And Bracket: Used to secure and protect the internal components, usually designed with metal or plastic materials and with heat dissipation function .
Interfaces And Connectors: Used for communication with the master chip or other devices. Common interfaces include the MIPI interface and the USB interface .
Auxiliary Components: Such as infrared fill lights, temperature sensors and microphones, etc., for filling light in low-light environments, monitoring temperature and providing audio support .
How To Cooperate With Us?
Demand Analysis
Communicate requirements with customers
Design Scheme
Design solutions that meet customer needs
Establish Cooperation
Provide camera module drawings and establish cooperation
Make Samples
Camera module proofing according to the design plan
Camera Module Test
Send out samples, and customers will test
Mass Production
After the samples pass the customer's test, mass production begins
Certifications
RoHS, REACH, ISO, CE, FCC
FAQ
Q: What is compact camera module?
A: Compact camera modules are widely used in electronic devices such as mobile phones and tablet computers. In order to reduce both the size and number of elements required the optical design will typically incorporate several highly aspheric surfaces.
Q: What are the different types of camera modules?
A: Divided by the position, there are 2 types of camera modules: a front camera module and a rear camera module.
Q: What is a DVP camera module?
A: The DVP camera module is a camera module that adopts the parallel digital video interface (Digital Video Port). It is mainly used in embedded devices and industrial vision systems. It transmits image data through the DVP interface and supports various resolutions and pixel configurations. It is suitable for scenarios such as security monitoring and smart hardware.
Q: What pixels does the DVP camera module have?
A: DVP camera modules are available from 0.1mp to 5mp. Common pixels include 0.5mp, 1mp, 2mp, 3mp, 4mp and 5mp, etc.
Q: What are the advantages of the DVP camera module?
A: The DVP camera module features simple interface and strong compatibility, making it suitable for embedded development with low cost. It supports multiple data formats and resolutions, and can meet the basic requirements of industrial inspection and security monitoring scenarios.
Q: What are the application scenarios of DVP camera modules?
A: DVP camera modules are widely used in industrial automation inspection, intelligent security monitoring and other scenarios. Their high compatibility and low cost also make them a common choice for consumer electronic products.
Q: What are the cost advantages of the DVP camera module?
A: The DVP camera module, with its high compatibility and low cost, combined with its stable parallel data transmission feature, makes it a cost-effective choice for visual solutions in embedded devices.
Q: Can the DVP camera module be used on the ESP development board?
A: The DVP camera module can be directly connected to the compatible ESP development board via the DVP interface, supporting the implementation of image acquisition functions. Its integrated solution is applicable to IoT terminal scenarios such as face recognition and environmental monitoring, and the MicroPython firmware provided with the development board simplifies the camera debugging process.
Q: What are the differences between DVP camera module and USB camera?
A: The DVP camera module uses a parallel interface and requires a main control chip for data processing, making it suitable for embedded development and low-latency scenarios; the USB camera has an internal controller and is plug-and-play but relies on the host's computing power. It has strong versatility but is more costly.
Q: What is a sensor module?
A: Sensor module is a device developed to detect the presence of an insert in overmolding injection process. The device is easy to apply and allows for a setting of the reading distance from the parting line. The sensor module is available with an embedded magnet.
Q: What are the importance components of camera module?
A: Among the main components of the camera module, the most important is the image sensor, because the sensor is the most important for image quality. The Sensor converts the light transmitted from the lens into an electrical signal, which is then converted to a digital signal by an internal DA.