On October 2, 2025, Sony Semiconductor Solutions Corporation launched the IMX775, an RGB-IR image sensor specifically developed for in-vehicle monitoring cameras, with mass production scheduled to start in spring 2026. This sensor achieves a performance breakthrough with a 1/2.64-inch size, approximately 5.04 million effective pixels, and an industry-leading minimum pixel size of 2.1μm (based on Sony's survey as of October 2025). It provides a high-precision solution for in-vehicle occupant monitoring and also points out the development path of global in-vehicle monitoring technology.

I. IMX775: A Technological Breakthrough Redefining In-Vehicle Monitoring
Key Specifications of IMX775
| Specification Category | Detailed Specifications |
| Sensor Size | 1/2.64 inch |
| Effective Pixels | Approximately 5.04 million pixels |
| Pixel Size | 2.1μm (smallest in the industry, as of Oct 2025) |
| Near-Infrared Quantum Efficiency | ≥35% at 940nm wavelength |
| RGB Dynamic Range | 110dB |
| Reliability Certifications | In progress: AEC-Q100 Grade 2, ASIL-B (ISO 26262) |
| Security Features | Optional: Public key algorithm-based identity authentication, image tamper-proofing |
| Mass Production Plan | Spring 2026 |

As the first dedicated in-vehicle sensor that balances high resolution and multi-spectral imaging, the IMX775's core advantages lie in three major technological innovations. In terms of infrared sensing, through the optimized concave-convex structure inside pixels and diffracted light absorption design, it can accurately capture subtle movements such as the driver's gaze deviation and blink frequency even in low-light environments like nights or tunnels. In terms of dynamic range performance, it adopts a hybrid exposure technology combining rolling shutter and global shutter, which can easily handle extreme light contrast scenarios where direct sunlight and in-vehicle shadows coexist, avoiding overexposure in bright areas or loss of details in dark areas.
More importantly, its single-chip integration capability: through the independently developed NIR crosstalk elimination algorithm, it solves the color reproduction distortion problem of traditional RGB-IR sensors. At the same time, it has built-in functions such as super-resolution processing and context switching, enabling image optimization and regional cropping output without an external ISP. This reduces the module size by more than 30% compared with traditional solutions. In terms of reliability, the sensor is compatible with in-vehicle cybersecurity requirements, further solidifying its application foundation in in-vehicle scenarios.

II. In-Vehicle Monitoring Cameras: Development Trend from "Safety Monitoring" to "Intelligent Sensing"
The technical layout of the IMX775 clearly points to three major future trends in in-vehicle monitoring, as the industry is upgrading from basic safety monitoring to in-depth intelligent sensing.
- Single-Chip Multi-Spectral Fusion Becomes Standard: Traditional in-vehicle monitoring requires separate visible light and infrared cameras. The RGB-IR integrated design of the IMX775 verifies the feasibility of a single-chip solution. In the future, cameras will further integrate near-infrared, visible light, and even short-wave infrared spectra to achieve full coverage of "daytime color reproduction + nighttime detail capture + special scenario recognition", while reducing module complexity and cost.
- Biometric Accuracy Moves Toward "Millimeter-Level": With the increasing penetration of L2+ level autonomous driving, monitoring requirements have upgraded from "whether the driver is fatigued" to accurate judgment of "attention level" and "passenger safety status". In the future, cameras need to support gaze tracking (error ≤1°), micro-expression recognition, child seat occupancy detection, and even health status monitoring. This requires the sensor resolution to advance to 8 million pixels, while improving light sensitivity as the pixel size is miniaturized.
- Dual Compliance of "Functional Safety + Cybersecurity": After the transformation of the automotive electronic architecture to a centralized model, the safety weight of cameras has significantly increased. In the future, they not only need to meet hardware standards such as AEC-Q100 and ASIL-B but also have capabilities such as encrypted image transmission, identity authentication, and data tamper-proofing to avoid monitoring failure or data leakage caused by malicious attacks.
- In-Depth Collaboration with In-Vehicle Intelligent Systems: Monitoring data will be connected to the vehicle central computing platform and linked with Advanced Driver Assistance Systems (ADAS) and cockpit systems. For example, when the driver's attention is distracted, the steering wheel vibration reminder is triggered; when a child is left in the car, the air conditioning is linked to keep running and an alarm is sent. This requires cameras to have low-latency transmission and flexible regional data output capabilities.
III. Camera Modules: Four Core Requirements for Matching Technological Upgrades
The technological breakthrough of sensors puts forward more stringent requirements for camera modules, which need to be upgraded simultaneously in optical design, hardware integration, reliability, and adaptability.
- Optical System Adapted to Multi-Spectral Imaging: It is necessary to equip IR-compatible lenses with a light transmittance of ≥90% in the 400-940nm wavelength range, and reduce glare through coating technology; the lens distortion should be ≤1% to avoid affecting biometric accuracy; the IR fill light should use the 940nm wavelength (invisible to the human eye) and support stepless brightness adjustment.
- Hardware Integration Evolves Toward "High Integration + Low Power Consumption": Support high-speed MIPI CSI-2 interface (4 Lane or above) to match the 60fps full-pixel output rate; optimize power management to control the overall module power consumption ≤1.5W; reduce external components and adopt integrated packaging to keep the size ≤15mm×15mm, adapting to the narrow installation space in the vehicle.
- Reliability Meeting Stringent In-Vehicle Environments: The operating temperature range should cover -40℃~85℃, and pass the 1000-hour high-temperature and high-humidity (85℃/85%RH) test; have IP67 dust and water resistance, and its electromagnetic interference resistance complies with CISPR 25 Class 3 standards to avoid interference with radar and navigation systems.
- Software and Algorithm Compatibility Upgrade: Provide an open SDK interface to be compatible with different in-vehicle computing platforms; have built-in image preprocessing functions (super-resolution, distortion correction) and support ROI (Region of Interest) data output; have fault self-diagnosis to report sensor abnormalities, interface disconnections, and other information in real time.
Conclusion
The launch of the IMX775 marks a leap from "seeing" to "seeing accurately and intelligently" in in-vehicle monitoring. The performance breakthrough of sensors needs to be implemented through precise module integration. In the next 1-3 years, camera modules with multi-spectral fusion, high-precision recognition, and dual safety compliance will become the standard configuration for mid-to-high-end vehicles, promoting the evolution of the automotive cockpit toward a more intelligent and safer direction. The technological layout of manufacturers such as Sony will also continue to define the industry's boundaries.





