As the "neural conduction pathway" for CMOS sensors, FPC (Flexible Printed Circuit) plays three core functions in camera modules:
Electrical Connection Hub:
It connects the sensor to the mainboard through gold wire bonding technology, forming a complete signal loop. The impedance stability of the FPC directly affects the quality of image data transmission.
Mechanical Support Framework:
With its ultra-thin and flexible characteristics (typically 0.1–0.3mm in thickness), FPC provides shock-absorbing space for components such as lenses and VCM motors. In multi-camera modules, it must withstand over 2,000 bending cycles.
Integrated Carrier:
Modern FPCs have integrated impedance matching lines, EMI shielding layers, and even embedded driver ICs, reducing module volume by more than 30%.
Key Selection Criteria:
Electrical Performance:
Impedance variation must be controlled within ±10%, and the gold plating thickness of the gold fingers should be ≥0.8μm.
